China urgently needs to develop high-precision diamond cutting tools
As an emerging renewable energy source, solar energy is being optimistic and concerned by scientists in the current situation of lack of energy. Commercial use of solar energy will become a worldwide trend. The birth of solar cells is a new tool for humans to use solar energy and is constantly improving.
Solar cells are mostly made of silicon materials. The silicon-based solar cells include: single crystal silicon cells and polycrystalline silicon thin film battery lamps, wherein the single crystal silicon solar cells have the highest photoelectric conversion efficiency and can reach 23%, and occupy a dominant position in large-scale applications and industrial production at this stage.
In recent years, with the maturity of semiconductor manufacturing technology, the manufacturing cost of silicon wafers is also decreasing. However, the cost of cutting silicon wafers in solar cell production has remained high, accounting for more than 30% of the total cost of solar cells. In order to prevent chipping during processing of the silicon wafer and to reduce material waste, the cutting of the silicon wafer tends to use a thin blade. At present, the blades used for cutting silicon wafers can be roughly classified into two types: electroplated blades having a thickness of 15 to 100 μm and resin blades having a thickness of 100 to 500 μm.
In China, the current technology for producing electroplated diamond super thin 115mm cutting disc is not mature enough. It is still in the experimental research stage. The ultra-thin cutting blades required for processing solar cell wafers mainly rely on imports from the United States, Germany, and Japan. Therefore, high-precision diamonds are developed. Cutting tools are an urgent problem to be solved in China’s tool and microelectronics industry.